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2021.05.06 13:00 UTC

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Fable: The Noble Double Nobellist

2021-05-06 15:30 ElectronicsWeekly David Manners

There was once a winner of two Nobel Prizes who left High School without a diploma. He won his first Nobel for Chemistry. He fell out with Robert Oppenheimer after Oppenheimer made a pass at his wife. He campaigned so successfully against nuclear weapons that he helped bring about the Nuclear Weapons Non-Proliferation Treaty and ...

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Samsung I-Cube4 puts 4 HBMs & logic die on paper-thin silicon interposer

2021-05-06 14:38 Embedded.com Nitin Dahad

Samsung Electronics has announced availability of its newest integrated 2.5D packaging solution, Interposer-Cube4 (I-Cube4), incorporating four high bandwidth memory (HBM) dies and one logic die on a 100㎛ thick silicon interposer.

The company’s I-Cube is a heterogeneous integration technology that horizontally places one or more logic dies (CPU, GPU, and other blocks) and several HBM dies on top of a silicon interposer, making multiple dies operate as a single chip in one package.

Its new I-Cube4, which incorporates four HBMs and one logic die, was developed in March as the successor of I-Cube2. From high-performance computing (HPC) to AI, 5G, cloud and large data center applications, I-Cube4 is expected to bring another level of fast communication and power efficiency between logic and memory through heterogeneous integration.

Samsung I-Cube_integration_technology
Samsung’s interposer cube (I-Cube) package structure. The new I-Cube4 2.5D packaging solution incorporates four HBM dies and one logic die on a 100㎛ thick silicon silicon interposer.

In general, the silicon interposer area proportionally increases to accommodate more logic dies and HBMs. Since the silicon interposer in the I-Cube is thinner (around 100㎛ thick) than paper, the chances of bending or warping a larger interposer become higher, which negatively impacts product quality. Samsung said its expertise and knowledge in semiconductors enabled it to study how to control interposer warpage and thermal expansion through changes to material and thickness, succeeding in commercializing the I-Cube4 solution.

Additionally, Samsung has developed its own mold-free structure for I-Cube4 to efficiently remove heat and enhanced its yield by conducting a pre-screening test that can filter out defective products during the fabrication process. This approach provides additional benefits such as a reduction in the number of process steps, which result in cost savings and shorter turnaround time.

“With the explosion of high-performance applications, it is essential to provide a total foundry solution with heterogeneous integration technology to improve the overall performance and power efficiency of chips,” said Moonsoo Kang, senior vice president of foundry market strategy at Samsung Electronics. “With the mass-production experience amassed through I-Cube2 and the commercial breakthroughs of I-Cube4, Samsung will wholly support customers’ product implementations.”

Since the launch of I-Cube2 in 2018 and eXtended-Cube (X-Cube) in 2020, Samsung said its heterogeneous integration technology has signaled a new era in the high-performance computing (HPC) market. The company is currently developing more advanced packaging technologies to I-Cube6 and higher by using a combination of advanced process nodes, high speed interface IPs and advanced 2.5/3D packaging technologies, which will help customers design their products in the most effective way.

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GloFo and PsiQuantum manufacturing chips for 1 million+ qubit quantum computer

2021-05-06 14:06 ElectronicsWeekly David Manners

PsiQuantum, which aims to build a 1 million-plus qubit quantum computer, and Globalfoundries are now manufacturing the silicon photonic and electronic chips that form the foundation of the PsiQuantum system. The companies say they can manufacture core quantum components, such as single-photon sources and single-photon detectors, with precision and in volume, using standard semiconductor manufacturing processes. The ...

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IBM develops 2nm GAA process

2021-05-06 13:01 ElectronicsWeekly David Manners

IBM has announced development of a semiconductor process using a 2nm GAA transistor which delivers a transistor density of 333 million transistors per square millimeter (MTr/mm2). The process, compared to 7nm, improves performance by 45% at the same power, or 75% energy at the same performance.compared to modern 7nm processors. The 3-stack GAA transistor has ...

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Narrow red phosphor boosts 90CRI efficacy

2021-05-06 12:39 ElectronicsWeekly Steve Bush

Bridgelux has released a CRI=90 family of leds that use a narrow band red phosphor to increase efficacy. Called F90, the series uses potassium fluorosilicate (PFS) phosphors licensed from Current Lighting Solutions of Ohio. “For traditional LED technology, higher CRI results in a lower efficacy,” according to Bridgelux. “By replacing broadband red nitride phosphor with narrow-band ...

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PCIM: On’s 1.2kV SiC diodes and 650V superjunction mosfets

2021-05-06 12:02 ElectronicsWeekly Steve Bush

On Semiconductor announced 1,200V SiC diodes with automotive AECQ101 and industrial qualification at virtual PCIM. Of the diodes, On said: “The new design improves on the first generation SiC diodes thanks to a smaller die size and lower capacitance. NVDSH20120C, NDSH20120C, NVDSH50120C, and NDSH50120C deliver a lower forward voltage drop and a 4x increase in ...

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Reduced operation set computing (ROSC) for NNA functional coverage

2021-05-06 11:44 Embedded.com James Imber, Tim Atherton

While the RISC (reduced instruction set computer) design philosophy has changed the face of computing forever, in this article we present a new take on functional coverage for neural network accelerators: reduced operation set computing, or ROSC.

Looking at RISC and how it evolved, the emphasis is on a small, highly flexible, and low-level instruction set allowed deeper pipelining, a shift in complexity to the compiler, and better overall performance. RISC has dominated computer architecture for decades and is fundamental to today’s leading processor architectures.

However, the advantages of RISC evaporate in applications where computation is dominated by a small number of complex operation types. A prime example of this kind of compute problem is convolutional neural network (CNN) inference, where the vast majority of compute and bandwidth requirements are for a small number of layer types: for example, convolution, pooling, and activations. In a setting like this a hardware accelerator is called for with dedicated, fixed-function implementations of these common tasks. Doing anything other than this will result in suboptimal hardware, consuming more power and area to reach the same target number of operations per second.

Enter the concept of ROSC

Building a neural network accelerator (NNA) around highly optimized fixed-function hardware works very well for the vast majority of the compute requirements for the network. However, there will inevitably be a large number of relatively uncommon layer types left over: these typically account for a small fraction of the compute requirements, and may include layers such as softmax, argmax and global reductions among many others. We need a good way to handle these leftover layer types.

The problem with highly optimized, dedicated hardware accelerators is that they are narrow in focus: every module must by necessity be designed to do one task extremely well. This results in narrow specialization, which is usually understood to limit the application of that hardware to the domain for which it was designed.

Reduced operation set computing (ROSC) is Imagination Technologies’ (IMG’s) solution to this problem. It comes from the realization that some hardware accelerators contain a highly disguised, general operation set. ROSC is building new operations (for which specialized hardware does not exist on the accelerator) out of one or more of the available fixed-function operations.

How to do this is at first non-obvious and often requires some creativity – the hardware sometimes gets used in highly unorthodox ways! However, as a library of such techniques is built up to implement common operations, it becomes progressively easier to reuse them to build new operations. As a methodology, this can extend the flexibility of the accelerator well beyond its primary applications. It brings many of the advantages of RISC to hardware accelerators, such as operation reuse, generality and a shift in complexity to the compiler, without the need to introduce new hardware.

The more conventional alternatives to ROSC are generally as follow:

  • Perform these operations on another device, such as a CPU, GPU or DSP. This is undesirable because it consumes system bandwidth and valuable compute resources from the rest of the system.
  • Include a general-purpose programmable unit such as a microprocessor within or alongside the design. This adds the missing functionality but increases hardware complexity and the power and area overhead. The computational density (ops per unit area) is generally lower for this kind of hardware compared to fixed-function hardware.
  • Add more dedicated hardware blocks for each missing layer type. Although this allows for highly optimized implementations of new modules, it puts the architecture in the position of perpetually playing catch-up to the state of the art (that is, it is not futureproof). It also leads to problems with hardware bloat and dark silicon.

All the above have disadvantages, such as increasing area and power consumption or consuming system resources such as CPU time and bandwidth. By contrast, ROSC provides an elegant way to reuse our existing fixed-function hardware for common neural network operations to cover a very wide variety of other layer types.

Using ROSC to build complex layers

For example, softmax could be built out of hardware-supported operations as shown below. The target architecture in this case is IMG’s Series4 NNAs.

ROSC article figure 1
  • A 1×1 convolution with a weight tensor with a single filter composed entirely of ones can be used to implement the cross-channel sum.
  • Division can be implemented as a multiplication of one tensor with the reciprocal of the other. IMG Series4’s LRN (local response normalization) module can be configured to compute a reciprocal.
  • Cross-channel max can be done by transposing the channels onto a spatial axis and doing a series of spatial max-pooling ops. Afterwards, it is transposed back onto the channel axis.
  • Since the exponential is limited to negative and zero input values, the activation LUT can be configured with an exponential decay function.

Using fixed-function hardware in ways other than the usual mode of operation can reduce utilization. Nevertheless, the benefits of keeping data on-device usually outweigh the drawbacks. For example, suppose that we only achieve 1% utilization of a 4-core IMG Series4 NNA for the above implementation of softmax. This NNA can achieve 40 TOPS at full utilization, so even at 1% utilization this still works out at a very respectable 400 GOPS. The availability of on-chip memory coupled with Imagination’s tensor tiling algorithm means that the intermediate data can be kept local, minimizing bandwidth consumption. Finally, we have avoided the need for a coprocessor to execute this layer, and do not need to consume host CPU time. ROSC is good for code reuse. For example, once we have produced implementations for division and cross-channel maximum for softmax, we can reuse these in other layers. Consider the instance normalization implementation below, which reuses the division implementation from softmax. The square root operation is also implemented via the LRN module. The global mean reduction uses the same trick as we used for global max reduction in softmax.

ROSC article figure 2

It is easy to see how a library of reusable low-level building blocks can be built up in this way, making it progressively simpler to implement new layer types. This is how we can achieve futureproofing using ROSC. ROSC also fits naturally within existing graph lowering compilers such as Glow and TVM, where we can decompose high-level layers into a computational graph as shown above and replace each part in turn with subgraphs composed of primitive neural network operations.

In applications dominated by a small set of complex operations, such as neural network inference, computational density is maximized using fixed-function hardware, resulting in a CISC processor with what appears at first sight to be extremely limited functional coverage. However, we have found that we can re-task dedicated NNA hardware (in our case, IMG Series4) to cover a surprisingly wide range of layer types.

Using the hardware in this highly unorthodox way tends to reduce utilization. However, the parts of the workload we apply it to are small and we find that it is very often a price worth paying as it increases performance overall, and reduces both bandwidth and power, particularly since the NNA is so computationally powerful compared to other available devices in a typical SoC.

James Imber

James Imber is a member of Imagination Technologies’ AI research team, where he works primarily on neural network accelerators, compilers and low-precision inference targeting embedded systems. With nine years’ experience as a researcher in the semiconductor IP industry, he has accumulated 24 granted patents and has contributed to publications in international computer vision conferences including ECCV and ICPR. He undertook his PhD studies at the University of Surrey’s center for vision, speech and signal processing (CVSSP) on shape-assisted intrinsic image decomposition and holds a BEng from the University of Southampton in electronic engineering.

Tim Atherton

Tim Atherton is director of research in AI at Imagination Technologies. Prior to joining Imagination Tim was a prize-winning academic (computer science) at Warwick University specializing in mathematical models of biological vision, high performance computing (HPC) architectures and technology transfer to commercial and government organizations.


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Japan heavyweights combine on hydrogen engines

2021-05-06 11:17 ElectronicsWeekly David Manners

Kawasaki Heavy Industries, Yanmar Power Technology and Japan Engine Corporation have got together to develop hydrogen fuelled marine engines for ocean-going and coastal vessels towards establishing a world-leading position in hydrogen engine technologies. With the growing need to reduce greenhouse gas emissions, marine engines are expected to transition to various alternative fuels in the coming ...

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Pico Wireless is an ESP32 add-on board for Raspberry Pi Pico

2021-05-06 09:54 CNXSoft Jean-Luc Aufranc (CNXSoft)

I understand hardware is cheap now, but the madness has to stop! Pimoroni Pico Wireless...

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Oxbotica and Navtech launch radar localisation system

2021-05-06 07:24 ElectronicsWeekly David Manners

Oxbotica and Navtech have launched Terran360, an all-weather radar localisation solution for industrial autonomous vehicles, with the pioneering technology typically accurate to <10cm on any vehicle, in any environment. Combining Navtech’s FMCW radar sensor and Oxbotica’s autonomy software platform, Terran360 is a new offering to the off-road autonomy market. It utilises a single long-range, high-definition ...

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2020 semi market hit $473bn

2021-05-06 07:11 ElectronicsWeekly David Manners

In 2020, the semiconductor industry marked its third year in the last four of double-digit expansion, says Omdia. 2020 semiconductor revenue grew 10.4% in 2020 over 2019 to finish at $473.3 billion, says Omdia in its Semiconductor Competitive Landscape Tool (CLT). The last three months of 2020 were the best quarter ever recorded for semiconductor revenue, ...

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TechWorks 2021 Awards open for entries

2021-05-06 07:10 ElectronicsWeekly Alun Williams

TechWorks is now accepting award applications for the 2021 TechWorks Awards Ceremony, which celebrate excellence within the technology industry. The organisation is looking to recognise organisations who have achieved significant business improvement through development of new products, processes, operational excellence market innovation and outstanding performance within the last year. This year, the awards are split ...

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Afdec sees uptick

2021-05-06 07:01 ElectronicsWeekly David Manners

Afdec reports a March uptick in Bookings and Billings activity as components customers realign their order book in-line with extending manufacturer lead-times. Total Monthly Billings (Net Sales Invoiced less Credits) in March ’21 increased by 35% when compared to the previous month and by 11% when compared to the same month 2020. Overall Bookings (Net Sales ...

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Z-Pi 7 Z-Wave gateway devkit works with Raspberry Pi and Orange Pi Zero boards

2021-05-06 05:48 CNXSoft Jean-Luc Aufranc (CNXSoft)

WiFi & Bluetooth are the most popular wireless protocols for home automation, alternatives like Zigbee...

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US Car Makers Want To Use National Security Law To Force Chip-Makers To Supply Them

2021-05-06 02:05 ElectronicsWeekly David Manners

The US auto industry is going to make itself very unpopular if it persuades President Joe Biden to use the law to force chip manufacturers to dump its non-auto chip customer to make chips for autos. Even worse is the choice of law which the car companies want the President to invoke – the 1950 ...

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Martian rover has some Linux computers, too

2021-05-05 22:27 LinuxGizmos Eric Brown

NASA’s Perseverance rover is equipped with a Linux-driven, Atom-based CompuLab COMEX-IE38 module designed to compress images. The rover also has a Qualcomm 801 Linux system like its Ingenuity copter, which is embarking on a new scouting mission. As LinuxGizmos and many other sites reported in February, NASA’s semi-autonomous Ingenuity drone copter is equipped with an […]

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Help with an old RS volt meter module?

2021-05-05 17:18 ElectronicsWeekly Steve Bush

A plea for help has arrived in the EW inbox Does anyone have any information on an RS 257-571 panel meter? The data sheet would be perfect, but if you have a heap of ancient catalogues around, a scan of the catalogue page would probably be enough. Reports are that it is a 4 1/2 ...

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PCIM: IGBT gate drivers for MW-scale railway traction

2021-05-05 16:30 ElectronicsWeekly Steve Bush

Power Integrations is aiming at railway traction with a set of gate drivers for 130 x 140mm IGBT modules from manufacturers including Infineon, Mitsubishi, Hitachi and ABB. Numbered 1SP063xxxx1R, the drivers match the footprint of single-channel IHM IGBT-modules with 1.2 to 1.4kA outputs and 3.3kV blocking voltage. There are three boards in the set: the ...

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Graphcore adds to N.American channel partners

2021-05-05 15:49 ElectronicsWeekly David Manners

Graphcore has added new channel partners in North America, extending the company’s sales presenceacross the continent and deepening its commitment to customers. The companies, which serve both the United States and Canada, will offer advanced AI compute systems for datacentres, based around Graphcore’s Intelligence Processing Unit (IPU), IPU-M2000 AI blade, and IPU-POD scale-out solution. Joining ...

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ClusBerry-2M Industrial IoT controller takes two Raspberry Pi Compute Modules 4

2021-05-05 15:33 CNXSoft Jean-Luc Aufranc (CNXSoft)

Earlier this year, Techbase introduced the ClusBerry 9500-CM4 cluster system for industrial IoT that can...

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PCIM: Fast switching trench Schottky rectifiers are AEC-Q101 approved

2021-05-05 14:45 ElectronicsWeekly Steve Bush

Nexperia has extended its trench Schottky rectifier range with devices rated at up to 100V and 20A in the company’s ‘CFP’ packages with an internal copper clip (right), intended to have smaller footprints than SMA, SMB or SMC diodes. “Nexperia’s trench Schottky rectifiers combine low forward voltage and low Qrr to enable efficiency at high switching ...

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Farnell signs CUI

2021-05-05 14:21 ElectronicsWeekly David Manners

Farnell has signed a global franchise agreement with CUI to expand its line card and power portfolio with 780 products from CUI’s range of power products. CUI’s power range includes external and internal AC-DC power supplies and DC-DC converters. CUI was originally focused on oscilloscopes and electromechanical components, before moving into the design and manufacture of ...

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Kitronik creates discovery kit for the Raspberry Pi Pico

2021-05-05 13:14 ElectronicsWeekly Alun Williams

Kitronik releases a discovery kit for the Raspberry Pi Pico, to encourage more young people to become interested in electronics and coding.

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The Cost Of Subsidy For A 7nm Fab

2021-05-05 13:02 ElectronicsWeekly David Manners

The cost of an Intel 7nm fab seems to be $10 billion – that is the price quoted for each of the two planned 7nm Arizona foundry fabs and for the new Israeli 7nm fab which Intel has just started building. It is also the amount it will cost the EU if it decides to accept ...

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PCIM: IC generates 12V from 30V to 1,200V for automotive emergency traction inverter PSU

2021-05-05 12:59 ElectronicsWeekly Steve Bush

Power Integrations has announced a 900V version of its InnoSwitch3-AQ automotive-qualified isolated fly-back dc-dc converter IC family, and a reference design using it for a PSU that will create 12V from anywhere between 30V and 1.2kV. This huge input range is needed within the emergency dc-dc PSU built into electric vehicle traction inverters – the ...

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SigmaStar SSC33x Camera SoCs are pin-to-pin compatible with Hisilicon Hi3516/Hi3518 processors

2021-05-05 12:20 CNXSoft Jean-Luc Aufranc (CNXSoft)

We’ve been writing a fair amount of posts about SigmaStar SSD201/SSD202D processors for smart displays...

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UK government appoints Indro Mukerjee as new Innovate UK CEO

2021-05-05 11:25 ElectronicsWeekly EW Staff

The UK Business Secretary, Kwasi Kwarteng, has appointed Indro Mukerjee as the new CEO of Innovate UK, an organisation seeking to help develop the UK innovation and drive investment in research and development. Specifically, he will be responsible for developing the UK’s innovation capability, driving investments in research and development (R&D) and technologies of the ...

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ST says it’s not joining EU chip effort

2021-05-05 07:31 ElectronicsWeekly David Manners

ST CEO Jean-Marc Chery has welcomed the EU’s initiative to give the EU a leading edge capability in semiconductors and to gain 20% world market share, but says that ST will not be joining in the effort. “We see this in a positive way,” Chery told BFM Business referring to the EU initiative, “it will ...

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Samsung to regain No.1 semi slot in Q2

2021-05-05 07:24 ElectronicsWeekly David Manners

Driven by a resurgent memory market and relatively flat sales results from Intel, IC Insights believes that Samsung will again replace Intel as the leading semiconductor producer beginning in 2Q21. Moreover, Intel is guiding its full-year 2021 sales to be down 1% as compared with 2020. With the DRAM market on the rise and the ...

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ERNI Electronics signs Digi-Key for global distribution

2021-05-05 07:10 ElectronicsWeekly Alun Williams

ERNI Electronics has signed a global distribution partnership with Digi-Key Electronics for its robust miniature connectors, aimed at industries such as IoT, automotive, transportation, aerospace, military, industrial, medical, lighting, communications and instrumentation. The ERNI connectors and cable assemblies – highlighted for security and strong vibration resistance – include dual beam female contacts, terminal position assurance ...

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Switch contains chip resistors as voltage dividers

2021-05-05 07:01 ElectronicsWeekly David Manners

Panasonic’s diagnostic ASQMR IP67 micro switch contains two chip resistors as voltage dividers. This feature facilitates the detection of the failure modes lead wire break or short circuits – and thus prevents the application from experiencing a serious failure or possibly causing severe damage. Setting different output voltage levels for normal vs. failure mode, the ...

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Champion Apprentice

2021-05-05 07:00 ElectronicsWeekly David Manners

Kaiden Ashun (pictured) from Cardiff has won this year’s Screwfix Trade Apprentice Award. There were ten finalists who were judged by a panel of industry experts including representatives from the NICEIC, CIPHE, FMBand Screwfix Top Tradesperson 2019, Darren McGhee. Kaiden demonstrated an entrepreneurial nature, passion for a future in the trade and a desire to keep ...

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Imago “VisionAI” Smart AI Camera supports Tensorflow Lite & AutoML Vision Edge

2021-05-05 06:31 CNXSoft Jean-Luc Aufranc (CNXSoft)

Imago Technologies GmbH “VisionAI” is a programmable Smart AI camera that combines a quad-core Cortex-A53...

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Top Ten (less 5) Capacity Leaders

2021-05-05 02:00 ElectronicsWeekly David Manners

Thanks to IC Insights for this – the top five capacity leaders:

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Gadget In Extremis: Parker Solar Probe becomes fastest human-made object

2021-05-04 18:41 ElectronicsWeekly Alun Williams

Talk about setting the controls for the heart of the sun...NASA's Parker Solar Probe is doing that, repeatedly, setting new records in the process.

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Edge AI camera runs Linux on quad -A53 SoC with Google Edge TPU

2021-05-04 18:35 LinuxGizmos Eric Brown

Imago’s 5MP “VisionAI” camera runs Linux on a quad -A53 SoC accompanied by a Google Edge TPU for TensorFlow Lite and AutoML Vision Edge. Other features include 2GB DDR4, microSD, GbE, and DIO. Imago Technologies GmbH announced a “freely programmable,” 5-megapixel edge AI camera designed for AI/ML and deep learning enabled image processing applications including […]

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Jetson powered Boxer-8200 systems are now preinstalled with Nvidia Ubuntu

2021-05-04 16:48 LinuxGizmos Eric Brown

Aaeon announced that its Jetson based Boxer-8200 series of embedded PCs will now pre-install Canonical’s Nvidia Ubuntu stack complete with Jetpack 4.5. New Secureboot customization services are also available. Aaeon’s Boxer line of compact embedded computers dates back over a decade or more with models such as the Intel Celeron based Boxer AEC-6905. Recently, most […]

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Tiny optical proximity detector works up to 200mm and down to 7μA

2021-05-04 15:53 ElectronicsWeekly Steve Bush

Vishay has created a complete proximity sensor inside a single surface-mount package – integrating laser (940nm VCSEL), photodiodes, amplifiers, ADC and DSP into 2 x 1.25 x 0.5mm. Called VCNL36825T, it can detect objects up to 200mm away through a hole as small as 1.6mm, and pulsed operation allows power to be reduced, to an average ...

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EU gets its vax act together

2021-05-04 15:30 ElectronicsWeekly David Manners

The EC is about to sign a deal with Pfizer/BioNTech for the delivery of 1.8 billion doses between 2021 and 2023, which would cement the drug’s central role in Europe’s vaccination campaign. According to the European Centre for Disease Control and Prevention, more than 80 million doses of the Pfizer vaccine – had been administered ...

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Ebyte E104-BT11 Bluetooth Mesh module features Silicon Labs EFR32MG21 MCU

2021-05-04 13:00 CNXSoft Jean-Luc Aufranc (CNXSoft)

Ebyte E104-BT11 is a Bluetooth Mesh module offered in four variants with support for gateways...

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Eval kit for ventilator flow rate and pressure

2021-05-04 12:21 ElectronicsWeekly Steve Bush

Sensirion and Nicolay have teamed up to offer an evaluation kit that measures air flow and pressure for human ventilator development. The companies already have an evaluation kit for proximal measurements of inspiratory and expiratory respiratory gas flow rates – Sensirion makes the flow sensors and Nicolay the connector and cable. “Having received many inquiries from ...

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PCB-mount common-mode chokes for 10 to 50A and 300Vac

2021-05-04 11:44 ElectronicsWeekly Steve Bush

Schurter has introduced a series of through-hole PCB-mount common-mode chokes for use at between 10A and 50A and up to 300Vac or 450Vdc. For single-phase applications, DKIV-1 chokes are available with ferrite or nano-crystalline cores. “Like all other aspects of electronic design, the power section is often-times built today using discrete components on printed circuit ...

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Crowdfunded “Mi Mini PC” Windows 10 Mobile PC remains undelivered after 3 years

2021-05-04 11:16 CNXSoft Jean-Luc Aufranc (CNXSoft)

Crowdfunding can be fun, but also risky for backers, especially when backing projects from startups....

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Q1 semi sales up 17.8%

2021-05-04 10:56 ElectronicsWeekly David Manners

Q1 semiconductor sales of $123.1 billion were up 3.6% on Q4 and 17.8% up q-o-q, reports the SIA. March sales were $41 billion – up 3.7% compared on February. “Global semiconductor sales remained strong during the first quarter of 2021, topping sales from the previous quarter and substantially outpacing the total from the first quarter ...

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Nvidia Jetson SBC supports Ubuntu, Jetpack 4.5 and Secureboot

2021-05-04 10:54 ElectronicsWeekly Steve Bush

Taiwanese computer maker Aaeon has signed a deal with Canonical to pre-install Nvidia Ubuntu on Aaeon’s Boxer-8200 embedded PCs which are built around Nvidia Jetson system-on-modules – removing the need for customers to flash an operating system image before first start-up. Systems with the Ubuntu OS will also include Jetpack 4.5 drivers and its toolkit ...

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Sponsored Content: The growth in horticultural lighting systems provides food for thought

2021-05-04 10:00 ElectronicsWeekly Sponsored Content

High efficiency, programmable power supplies play a vital role in helping the supply of high yield crops, in a sustainable manner to supply food around the world, writes John Stone. Cultivating crops indoors allows farmers to grow a steady supply of crops all year round and regardless of external weather conditions. LED lighting offers output ...

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‘The semiconductor market is booming’

2021-05-04 09:53 ElectronicsWeekly David Manners

Infineon had calendar Q1 (fiscal Q2) revenues of €2.7 billion for a profit of €470 million at a margin of 17.4%. For calendar Q2 (fiscal Q3) revenue is predicted to come in between €2.6 billion and €2.9 billion with a margin of around 18%. For the fiscal year to the end if September, the company expects ...

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Intel to put $3.5bn into packaging

2021-05-04 07:31 ElectronicsWeekly David Manners

Intel will invest $3.5 billion in packaging technology at its Rio Rancho, New Mexico plant. The plant employs about 1,800 workers and will be retooled to deliver Foveros packaging technology. Intel currently develops and produces its EMIB packaging technology, silicon photonics products, and Optane media at Rio Rancho. The current investment does not include Optane which utilises 3D ...

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UMC will add capacity if customers pay for it

2021-05-04 07:30 ElectronicsWeekly David Manners

UMC has said it will add 20k wpm of 28nm capacity so long as customers pay up-front and guarantee orders at a set price. The addition would be made at UMC’s Tainan fab. The cost would lift UMC’s 2021 capex by 53% to $2.3 billion. Calling it an “innovative, win-win” arrangement, UMC CEO Jason Wang ...

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SiTime extends TCXO temperature range to -55ºC

2021-05-04 07:01 ElectronicsWeekly David Manners

SiTime has increased the operating temperature range of its Endura SiT5146 Super-TCXO. Previously, these devices operated down to -40°C, but now support -55°C. With this new capability, the SiT5146 delivers best-in-class stability over -55ºC to +105ºC, benefiting airborne applications such as low earth-orbiting (LEO) satellites, commercial aircraft, satellite communication systems, and rocket delivery systems as well ...

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